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Products
Burn-in/Test Socket (Clamshell Type)
Creative socket design as well as innovative pin design enables customers to enhance test quality and minimize test cost. HiCon’s engineering team works with customers to create dedicated designs for their special requirements and maximize their test capacity.
Application
BGA, LGA, QFN, QFP, etc.
Maximum Package Size
15mm x 16mm
Pitch
0.25mm ~
Application
BGA, LGA, QFN, QFP, etc.
Maximum Package Size
24mm x 24mm
Pitch
0.25mm ~
Application
BGA, LGA, QFN, QFP, etc.
Maximum Package Size
Customized
Pitch
0.25mm ~
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