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Hr-contact is a proven solution for DC test. Combination of Hr-contact for BGA ball and Hi-contact for LGA land provides an excellent solution to test IC package with BGA solder ball in center area and LGA land in corners. Furthermore, its better life cycle in comparison with commonly adopted solutions brings test cost down.

Application
BGA, LGA
Package Size
15.76mm x 11.90mm
Pitch
min. 0.25mm ~

Application
BGA, LGA
Package Size
13.00mm x 9.00mm
Pitch
min. 0.25mm ~

Application
BGA, LGA
Package Size
12.60mm x 6.20mm
Pitch
min. 0.25mm ~
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