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Open Top Socket

Hr-contact is a proven solution for DC test. Combination of Hr-contact for BGA ball and Hi-contact for LGA land  provides an excellent solution to test IC package with BGA solder ball in center area and LGA land in corners. Furthermore, its better life cycle in comparison with commonly adopted solutions brings test cost down.

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Application

BGA, LGA

Package Size

15.76mm x 11.90mm

Pitch

min. 0.25mm ~

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Application

BGA, LGA

Package Size

13.00mm x 9.00mm

Pitch

min. 0.25mm ~

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Application

BGA, LGA

Package Size

12.60mm x 6.20mm

Pitch

min. 0.25mm ~

HICON GLOBAL

Address: 1335 NORTH HOBSON STREET, GILBERT, AZ. 85233-1208

 Tel : +1 480-912-4038       Fax : +1 480-892-3301       Email : sales@hicon-global.com

© 2026 HiCon Global All rights reserved.

© 2026 HiCon Co., Ltd. All rights reserved.

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