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Products
LSI Socket for Large Device
HiCon has developed and provided advanced solutions to Burn-in test for fine pitch and large I/O IC. Hr-Contact for fine pitch IC and optimized socket design for customer’s special needs provide reliable and low cost solutions to Burn-in test for IC with fine pitch and large I/O. HiCon also provides advanced thermal solutions along with burn-in solutions.
Application
BGA, LGA, etc.
Maximum Package Size
35mm x 35mm
Pitch
0.25mm ~
With or Without Heat sink, Fan, Heater & RTD sensor
Application
BGA, LGA, etc.
Maximum Package Size
65mm x 65mm
Pitch
0.25mm ~
With or Without Heat sink, Fan, Heater & RTD sensor
Application
BGA, LGA 400 ~ 10,000 pins
Maximum Package Size
Customized
Pitch
0.40mm ~
Air Cooling
500W ~
With Heat sink, Fan, Heater & RTD sensor
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