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Technology
Design
HiCon is striving for further progress in design, product engineering, and quality engineering by introducing advanced analysis tools, test equipment, and measurement equipment. Our HFSS analysis and Thermal simulation capability offer customers optimized product design for their test requirements.
High Speed Solution
Increase the effectiveness of shielding by wrapping the signal pin with GND.
Thermal Solution
Heat Dissipation Efficiency
~450W @ 120°C
With Heat Pipe, Fin, Heater & RTD sensor
Heat Dissipation Efficiency
~1000W @ 120°C
With Liquid Cooler, Heater & RTD sensor
Optimized Heat Sink Design by Thermal Simulation
Optimized pin design by Ansys HFSS Simulation
Optimized Socket Deformation Simulation
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